Amkor forms multiyear advanced packaging partnership with Nvidia
AMKR•U.S. packaging and test capacity to expand
The deal targets more turnkey U.S. packaging and test capability, aiming to improve supply-chain resilience alongside Amkor’s existing Asia operations.
Roadmaps focus on AI infrastructure scale-up
The companies will align long-term roadmaps around high-density interconnects and next-generation heterogeneous integration to scale AI infrastructure production.
Amkor and Nvidia sign multiyear packaging partnership
Amkor Technology signed a multi-year strategic partnership with Nvidia to develop advanced semiconductor packaging and test for next-generation AI platforms.
Nvidia will make a prepayment tied to a capacity agreement to support an expansion of Amkor’s U.S. advanced packaging footprint in Arizona.
