Amkor Technology to Present Strategic Outlook at May 21, 2026 Investor Day
Amkor Technology will host an Investor Day in New York City on May 21, 2026, featuring presentations from President and CEO Kevin Engel, CFO Megan Faust and other senior leaders. The event will provide an in-depth review of the company’s strategy, key initiatives and financial outlook via live webcast and replay.
1. Amkor Technology to Host 2026 Investor Day
Amkor Technology has announced that it will host its 2026 Investor Day on Thursday, May 21 in New York City. The event will feature presentations by President and CEO Kevin Engel, CFO Megan Faust and other senior leaders, who will provide a detailed review of the company’s strategic priorities, capital allocation framework and medium-term financial outlook. Attendees will gain insight into Amkor’s operational road map, including capacity expansion plans across its global sites and progress on margin improvement initiatives. A live webcast and on-demand replay will be made available via the Amkor Investor Relations website, and institutional investors or financial analysts seeking to attend in person can register directly through the corporate IR team in the coming weeks.
2. Strategic Partnerships and Advanced Packaging Growth
Amkor’s long-term growth trajectory is underpinned by its partnership with Nvidia and the planned launch of advanced packaging services at its new $7 billion Arizona facility. Supported by U.S. Chips Act funding, the site is slated to begin high-density fan-out and system-in-package production for Nvidia’s next-generation AI accelerators in 2027–2028. In the near term, surging demand for Nvidia’s H200 chips, including a potential order of two million units from mainland China in 2026, is expected to drive a meaningful uplift in Amkor’s test and packaging volumes. This alignment with one of the largest AI platform providers, combined with an expanded geographic footprint covering Asia, Europe and North America, positions Amkor to capitalize on rising semiconductor content across data centers, automotive electronics and mobile devices.