AMAT•Applied Materials has added SCREEN Semiconductor Solutions as a partner at its 180,000-square-foot Silicon Valley EPIC Center, combining wet etch, cleaning, deposition and etch expertise to develop co-optimized wafer cleaning process solutions. The collaboration aims to drive higher yields and accelerate time-to-production for next-generation semiconductor devices.
Applied Materials has deepened its long-standing relationship with SCREEN Semiconductor Solutions by inviting the company to join the new EPIC Center in Silicon Valley. This collaboration merges SCREEN’s single-wafer wet etch and cleaning capabilities with Applied’s deposition, dry etch and materials modification expertise to co-optimize end-to-end processes for advanced chipmakers.
The EPIC (Equipment and Process Innovation and Commercialization) Center spans 180,000 square feet on Applied’s Silicon Valley campus and is designed to compress the commercialization cycle for next-generation semiconductor technologies by up to half. The facility will co-locate customers, partners and Applied’s engineers to accelerate R&D and integration of breakthrough materials engineering solutions.
By integrating surface preparation and wafer cleaning at each process stage, the joint teams expect to reduce defect rates and improve device performance at leading-edge nodes. Faster cycles of development and direct integration into Applied’s R&D programs are projected to shorten time-to-market for high-performance chips.