Applied Materials, Besi expand strategic partnership on next-generation advanced packaging for AI chips
AMAT•Applied Materials expanded its partnership with Besi to develop advanced packaging technology for AI-driven chip scaling, extending joint research and development at Applied’s EPIC Center. The work builds on a 2020 Singapore program and targets several packaging technologies; Applied’s EPIC Center investment was pegged at $5 billion.
1. Expanded research partnership
Besi joined Applied Materials’ EPIC Center as an innovation partner, broadening joint research and development beyond die-to-wafer hybrid bonding. The collaboration targets 3D IC scaling, tighter logic-memory integration, photonics interconnects, thermocompression bonding scaling, and new die-on-wafer and panel architectures.
2. Earlier program and investment
The partnership builds on a 2020 Singapore program that produced Kinex, an integrated die-to-wafer hybrid bonding system. Applied Materials’ EPIC Center investment was pegged at $5 billion, with the aim of speeding commercialization from research to high-volume manufacturing.
