Applied Materials Eyes €14bn BESI Buyout With 9% Stake
BE Semiconductor Industries has drawn takeover interest from Applied Materials and Lam Research, with Applied holding a 9% stake since April 2025 and exploring a full buyout. BESI’s chip-packaging technology, valued at €14bn, underpins AI and HPC chips and could trigger a US national security review in a buyout.
1. Takeover Interest in BESI
BESI has drawn takeover approaches from Lam Research and Applied Materials, marking intense competition for its chip-packaging business. Initial talks began in mid-2025, briefly paused due to US-EU geopolitical tensions, and have since resumed.
2. Applied Materials' 9% Stake
Applied Materials acquired a 9% stake in BESI in April 2025, becoming the largest shareholder and positioning itself for a full acquisition. The stake underscores Applied’s commitment to hybrid bonding technology and its ambition to expand its packaging solutions portfolio.
3. Advanced Packaging Technology Value
Hybrid bonding links chips with copper-to-copper connections, enabling faster AI and HPC data transfer with lower power consumption. BESI’s packaging unit is valued at €14bn, highlighting its critical role in next-generation semiconductor assembly and system integration.