ASML Develops Multi-Layer AI Chip Packaging While Executing €124.6M Share Buyback
ASML is developing advanced chip packaging, bonding and stacking solutions beyond EUV lithography to support multi-layered AI circuits and plans third-generation EUV systems after releasing the XT:260 AI scanner. Over five days through Feb.27, it repurchased 99,316 shares at an average €1,259.24 apiece, spending €124.6 million under its new buyback.
1. Expansion into Advanced AI Packaging
ASML is broadening its tool portfolio beyond EUV lithography by developing precision packaging and bonding equipment to stack specialized AI chips into multi-layer architectures. Chief Technology Officer Marco Pieters highlighted that these solutions, coupled with nanometer-scale interconnects and next-generation control software, aim to enhance AI performance and throughput over the coming decade.
2. Details of Current Share Buyback
Over five days ending Feb.27, ASML repurchased 99,316 shares at a weighted average price of €1,259.24 per share, totaling €124.6 million. The program, announced on Jan.28, operates under the Market Abuse Regulation and reflects management’s commitment to returning capital while optimizing the balance sheet.