Carrier Ventures Expands ZutaCore Investment to Scale Liquid Cooling for High-Density AI Data Centers
Carrier Global's venture group increased its funding of ZutaCore, bolstering direct-to-chip waterless liquid cooling within its QuantumLeap suite for high-density AI data centers. This follow-on investment enhances its interoperable single- and two-phase liquid cooling capabilities to manage rising AI chip power densities and energy performance.
1. Investment Expansion Details
On April 29, 2026, Carrier Ventures expanded its follow-on investment in ZutaCore, building on its 2025 funding to deepen its stake in direct-to-chip liquid cooling solutions. The additional capital strengthens the partnership aimed at scaling thermal management offerings for high-density AI data centers.
2. Advanced Cooling Technology
ZutaCore’s HyperCool technology delivers waterless, direct-to-chip cooling via a closed-loop two-phase system, enabling higher compute densities and improved energy efficiency. The integration of single- and two-phase cooling solutions enhances Carrier’s QuantumLeap™ suite for comprehensive data center thermal management.
3. Strategic Impact on AI Data Centers
The expanded investment advances Carrier’s strategy to address rising AI chip power densities by offering integrated liquid cooling across the data center thermal lifecycle. Enhanced energy performance and scalability position Carrier to capture growing demand for advanced thermal solutions in AI-driven infrastructure.