Ceva announced a major design win at a leading U.S.-based semiconductor company for its Bluetooth High Data Throughput (HDT) solution, which integrates digital baseband, software stack and Ceva’s internally developed RF technology into a single connectivity subsystem. This progression from standalone digital IP to a full-stack offering underscores Ceva’s strategy to simplify integration and accelerate time-to-market for advanced wireless devices.

Multiple customers are now moving Bluetooth 6.0 designs into production, triggering royalty streams that have begun to ramp this quarter. Early HDT evaluations across industrial, consumer and edge AI segments indicate a robust pipeline poised to drive recurring revenue growth as high-throughput applications proliferate.

The addition of integrated RF expands Ceva’s addressable market to include large system companies and major semiconductor players previously requiring turnkey wireless solutions. By serving both digital-only and full-stack requirements, Ceva can engage customers at multiple tiers of the wireless value chain and deepen multi-generational partnerships.

With annual Bluetooth device shipments in the billions and rising complexity from edge AI and data-intensive applications, demand for turnkey connectivity platforms is surging. Ceva’s evolved full-stack wireless portfolio positions it to capture a larger share of next-generation wireless platforms driving the smart edge.