Coherent has introduced Thermadite 800 Liquid Cold Plates featuring 800W/(m·K) thermal conductivity—roughly twice copper—and 60% lower density, enabling more than 15°C chip temperature reduction in AI accelerator cooling. The SiC-diamond composite supports complex microchannel designs aligned to real chip heat maps, minimizing pressure drop and coolant use to lower system operating costs.

Coherent shares declined 3% after Broadcom publicly backed direct-attach copper over co-packaged optics for rack-level AI clusters, dampening near-term enthusiasm for optical solutions. This reaction occurred despite Nvidia’s combined $2 billion investments in Coherent and Lumentum to secure optical components, underscoring ongoing debate over optimal data-center interconnect technology.