Flex's JetCool and Broadcom Unveil Liquid Cooling for 4 W/mm² AI XPUs
Flex's JetCool unit partnered with Broadcom to deploy a single-phase direct-to-chip liquid cooling system for multi-kilowatt AI XPUs, engineered to manage heat flux of 4 W/mm² per ASIC. The collaboration leverages Flex's global mass production capabilities to establish a production-ready thermal foundation for hyperscale AI infrastructure.
1. Collaboration Overview
JetCool, a Flex company specializing in liquid cooling solutions, has joined forces with Broadcom to integrate liquid cooling into next-generation AI XPUs. This partnership aligns mechanical, thermal and silicon design early in development to accelerate time to market for advanced AI hardware.
2. Technical Specifications
The joint solution features a single-phase direct-to-chip cooling design capable of sustaining multi-kilowatt ASIC performance at heat flux levels of 4 W/mm² per device. It integrates with Broadcom's mechanical and thermal reference architecture to optimize system reliability and deployment timelines.
3. Production and Scaling
Leveraging Flex's global mass production capabilities, JetCool will manufacture cold plates, manifolds and coolant distribution units at scale, ensuring consistent quality and supply for hyperscale data center deployments. This setup supports high-volume manufacturing demands as AI power densities increase.
4. Strategic Impact
By establishing a production-ready thermal foundation for hyperscale AI infrastructure, the partnership positions Flex to capitalize on growing demand for high-density compute cooling. It strengthens Flex's role in advanced thermal management and expands its footprint in the AI hardware supply chain.