GlobalFoundries to make key AI chip component for TSMC in $2 billion deal
GFS•GlobalFoundries reached a five-year, $2 billion agreement to make silicon interposers for TSMC at its Malta, New York, facility. Volume production is expected to begin ramping up in the first half of 2028.
1. Five-year manufacturing deal
GlobalFoundries will expand capacity at its Malta, New York, facility to produce silicon interposers for TSMC under the five-year agreement. The component sits beneath processors and memory chips in advanced AI packages and enables them to communicate at high speeds.
2. Production timeline
The company said the facility is expected to become the first U.S.-based source of silicon interposers used in advanced chip-packaging technologies. Volume production is expected to begin ramping up in the first half of 2028, and the deal provides a framework for future capacity expansion.
