Google Pushes Intel EMIB as Alternative to TSMC CoWoS for ASIC Packaging
GOOG•Google is urging chip partners to adopt Intel EMIB packaging as an alternative to TSMC’s CoWoS for its custom ASICs, leading MediaTek to court Intel alongside TSMC for advanced chip assembly. The move could reshape Google’s supply chain flexibility and reduce packaging costs for its AI infrastructure chips.
1. Google Packaging Strategy
Google’s AI infrastructure relies on custom ASICs requiring high-density interconnects; while TSMC’s CoWoS has long dominated advanced packaging, Google is evaluating Intel’s EMIB platform for potential cost savings, capacity diversification and thermal performance improvements in next-generation chips.
2. MediaTek's Dual Partnerships
In response to Google’s push, MediaTek is negotiating with Intel to leverage its EMIB technology while maintaining ties with TSMC for CoWoS orders; this dual-sourcing strategy aims to secure flexible packaging capacity and mitigate supply chain risks for high-performance ASIC production.
