HEICO Subsidiaries Deliver Memory, Capacitors and DC-DC Converters for Artemis II
HEICO Corporation’s subsidiaries 3D PLUS, Exxelia and VPT supplied mission-critical memory devices, capacitors, magnetics and radiation-hardened DC-DC converters for NASA’s crewed Artemis II mission around the Moon. The deployment on both the Space Launch System and Orion spacecraft highlights HEICO’s deep-space credentials and could drive additional high-reliability aerospace contracts.
1. Subsidiaries’ Contributions to Artemis II
HEICO’s 3D PLUS in Buc, France developed and produced high-density memory devices for both the Space Launch System and the Orion spacecraft, Exxelia in Paris supplied capacitors and magnetics products integrated into Orion, and VPT in Blacksburg delivered Class K and KL1 radiation-hardened DC-DC converters and EMI filters across both systems.
2. Technical Scope of Delivered Components
3D PLUS’s components included wafer-level stacked memory for navigation and life-support systems; Exxelia’s ruggedized capacitors and inductors supported power and control subsystems; VPT’s converters and EMI filters ensured stable power distribution in extreme radiation environments of deep-space flight.
3. Strategic Impact for HEICO
This high-profile mission underscores HEICO’s reputation in mission-critical aerospace electronics, showcasing nearly 220,000 flight-proven components in orbit and reinforcing its position as a preferred supplier for NASA and defense contractors seeking deep-space hardware.
4. Future Growth and Contracts
Successful integration on Artemis II paves the way for HEICO to bid on follow-on Artemis missions and other space programs, potentially increasing its space segment backlog and driving long-term revenue growth in high-reliability markets.