Kulicke & Soffa Unveils ASTERION-TW Ultrasonic System and ProMEM Suite Boosting Throughput 20%
Kulicke & Soffa launched ASTERION-TW, an ultrasonic welding system offering ±40 micron repeatability and bonding copper terminals up to 2 mm thick for power modules. It introduced ProMEM memory suite boosting throughput by up to 20% and forecasts its thermo-compression bonding business will grow 70% sequentially in fiscal 2026.
1. ASTERION-TW Ultrasonic Welding System
Kulicke & Soffa launched ASTERION-TW, a new ultrasonic terminal welding system designed for next-generation power module manufacturing. It features ±40 microns (3σ) weld placement repeatability, copper terminal bonding up to 2 mm thick, ±180° weld head rotation, a 150 mm vertical stroke and 300 × 300 mm work area, offering a solid-state alternative to mass reflow with zero emissions.
2. Expanded Memory Interconnect Portfolio
The company introduced the ProMEM memory suite, delivering up to 20% higher throughput across bond, bumping and looping processes, alongside vertical wire bonding and fluxless thermo-compression capabilities. It expects its thermo-compression bonding business to grow 70% sequentially in fiscal 2026 and is advancing hybrid bonding development to support emerging high-density memory architectures.