Lam Research sees glass substrates gaining momentum in advanced chip packaging

LRCX•2026-10-29

Glass substrates are gaining momentum in advanced chip packaging for larger, denser AI and high-performance computing packages, but manufacturing and standardization hurdles remain. Lam Research is investing in process research and panel-processing equipment to help customers scale glass-based packaging.

Lam Research sees glass substrates gaining momentum in advanced chip packaging

1. Glass packaging hurdles

2. Lam Research investment

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Lam Research sees glass substrates gaining momentum in advanced chip packaging

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