Lumentum teams with Qualcomm, Corning for optical die-to-die interconnect demo at ECOC 2026

Corning supplies high-density multimode fiber glass ferrules; Qualcomm provides the die-to-die interface IP subsystem for direct-drive optical connectivity.

Lumentum plans a joint ECOC 2026 demonstration with Qualcomm Technologies and Corning on high-density optical die-to-die connectivity for AI scale-up.

The board-level showcase targets co-packaged optics and near-packaged optics using emerging interfaces such as UCIe over multimode fiber spanning tens of meters.

The proof-of-concept uses 32 Gb/s NRZ optical channels; design targets about 1 Tb/s/mm shoreline bandwidth density, scaling toward about 4 Tb/s/mm.

Lumentum contributes a 1060 nm VCSEL optical engine with about 10 Tb/s aggregate transmit-receive capacity, using dense VCSEL-photodetector arrays.