MACOM Launches MACD-41804 for Low-Power, High-Density 1.6T OSFP Copper Interconnects
MACOM introduced its MACD-41804 Cable Driver with Equalizer to enable low-power, high-density 1.6T OSFP copper interconnects featuring input equalization and gain adaptation. The chip delivers reduced latency, lower system costs, broad dynamic range, mission-mode diagnostics and compact flip-chip packaging for high-volume manufacturing.
1. Product Launch
MACOM introduced the MACD-41804 Cable Driver with Equalizer, its latest copper connectivity solution designed for next-generation scale-up architectures. The new driver supports low-power, high-density data transmission over 1.6T OSFP copper interconnects and expands MACOM’s multi-channel equalizer lineup.
2. Technical Features
The MACD-41804 integrates input equalization, broad dynamic range, optional gain adaptation and mission-mode diagnostics to optimize signal integrity and link performance. These features enable precise monitoring and adaptive tuning of copper links under varying operating conditions.
3. Competitive Advantages
By eliminating the need for retimed architectures, the device offers lower power consumption, reduced latency and significant system cost savings compared to optical solutions. Its efficient design maintains high throughput while leveraging the inherent cost benefits of copper interconnects.
4. Availability and Packaging
The MACD-41804 is available in bumped die format within compact flip-chip packaging to support high-volume manufacturing. MACOM will showcase the solution at OFC 2026 in Los Angeles from March 17 to 19.