MACOM Unveils 3.2Tb Optical, 1.6Tb Copper Solutions and 800G Modules at OFC
MACOM will showcase at Booth 1227 March 17–19, showcasing 3.2Tb optical transmit solutions for 400G per lane PAM over SMF and a 1.6Tb ecosystem with 200G per lane optics, ACC and LPO in a 102.4T switch. Demos will feature PCIe 6.0/7.0 copper and optical interconnects, 800G coherent modules and CW lasers.
1. Event Participation
MACOM will exhibit at the Los Angeles Convention Center March 17–19, 2026, at Booth 1227 to engage data center, cloud infrastructure and telecom customers with live demonstrations.
2. Key Demonstrations
Highlighted demos include 3.2Tb optical transmit for 400G per lane PAM over single-mode fiber and a 1.6Tb ecosystem featuring 200G per lane retimed optics, low-power Active Copper Cable and Linear Pluggable Optics in a 102.4T switch; plus PCIe 6.0/7.0 interconnects, 800G coherent modules, CW lasers and onboard equalization.
3. Applications and Impact
These advanced photonics, optoelectronic and copper interconnect solutions target AI scale-up and scale-out architectures, cloud infrastructure, HPC, fronthaul and automotive LiDAR, promising higher bandwidth, improved signal integrity and lower power consumption.