MediaTek Adds CoWoS and EMIB Packaging; Samsung Ships 20% Faster HBM4E to Nvidia
NVDA•MediaTek now supports both TSMC’s CoWoS and Intel’s EMIB packaging, offering Nvidia and other AI chip customers dual-sourcing options. Samsung has started shipping 12-layer HBM4E memory samples—over 20% faster than its prior generation—to clients including Nvidia, potentially easing GPU supply and boosting AI performance.
1. MediaTek Enables Dual Advanced Packaging
MediaTek now supports both TSMC’s CoWoS and Intel’s EMIB technologies, granting custom silicon customers—including AI chip designers—a choice of packaging options. CoWoS and EMIB can affect performance and production timelines for high-performance GPUs such as those developed by Nvidia.
2. Samsung Begins Shipping 12-Layer HBM4E Samples
Samsung Electronics has shipped samples of its 12-layer HBM4E memory, offering over 20% speed improvement versus the prior generation. Major AI hardware customers including Nvidia, AMD and Google will test these chips ahead of volume production, targeting AI data centers.
3. Potential Impact on Nvidia’s GPU Supply Chain
The expanded packaging flexibility and faster HBM memory could alleviate supply constraints for Nvidia’s next-generation GPUs, potentially improving production ramp and performance benchmarks in its AI-focused product lines.
