MediaTek Adds Intel EMIB Support, Doubles 2026 Data Center Revenue Forecast
INTC•MediaTek now supports both TSMC’s CoWoS and Intel’s EMIB advanced packaging, letting customers choose for AI and custom chips. It doubled its 2026 data center revenue forecast to $2 billion and targets a 10–15% share of a $70–80 billion custom AI chip market.
1. MediaTek Supports Both Packaging Technologies
MediaTek announced support for TSMC’s CoWoS and Intel’s EMIB advanced packaging technologies, enabling customers to select either process for custom silicon, including AI and high-performance compute chips.
2. Intel EMIB Considered for Google AI Chips
Intel’s EMIB is being evaluated for MediaTek’s custom AI chips for Alphabet’s Google, potentially expanding EMIB adoption and opening a new customer channel for Intel’s advanced packaging business.
3. MediaTek’s Revenue Forecast and Market Targets
MediaTek doubled its 2026 data center revenue forecast to $2 billion, forecasts a $70–80 billion custom AI chip total addressable market in 2027, aims for a 10–15% share, and plans tests on TSMC’s A14 node and Arizona 4nm/3nm fabs.
