Microchip Debuts 3.3 kV HV-D3 SiC Modules for 100–300A AI Data Center Power
MCHP•Microchip launches 3.3 kV HV-D3 mSiC power modules integrating SiC MOSFETs and Schottky diodes in a 62 mm package to enable direct medium-voltage grid-to-rack power delivery for AI data center solid-state transformers. The modules feature 6 kV isolation, CTI 600 materials, Si₃N₄ substrates and support 100–300 A at high efficiency.
1. Product Launch
Microchip has introduced its 3.3 kV HV-D3 mSiC power modules integrating 3.3 kV SiC MOSFETs and Schottky diodes in a 62 mm package to enable solid-state transformer deployment in AI data centers by supporting direct medium-voltage grid-to-rack power delivery.
2. Technical Features
The modules deliver 100–300 A with 6 kV isolation, CTI 600-rated materials, Si₃N₄ substrates for enhanced thermal conductivity and power cycling, and require roughly half the series devices of lower-voltage SiC alternatives when interfacing with 13.8 kV or 34.5 kV grids.
3. Applications and Availability
Beyond AI data center transformers, these modules address heavy-duty vehicle charging, rail auxiliary power, medium-voltage motor drives and defense systems; they are available now in half-bridge and common-source configurations, backed by global support, design guides and simulation models for rapid prototyping.
