Micron Agrees to $1.8B for Taiwan Tongluo Fab, DRAM Output by H2 2027
Micron has signed an exclusive letter of intent to acquire Powerchip Semiconductor’s 300,000-square-foot P5 fabrication site in Tongluo, Taiwan for US$1.8 billion, targeting regulatory closing by Q2 2026 and phased DRAM production beginning in H2 2027. The deal also establishes a long-term PSMC partnership for post-wafer assembly processing and leverages proximity to Micron’s Taichung operations to bolster global memory capacity for surging AI-driven demand.
1. Accelerating Financial Growth Fuels Trillion-Dollar Ambition
In Q1 FY26 Micron generated $13.64 billion in revenue, marking a 57 percent year-over-year increase, while net income surged 180 percent to $5.24 billion. These results delivered a 38.4 percent net profit margin—one of the highest in the semiconductor sector—and underpin management’s guidance for continued record revenue, gross margin, EPS and free cash flow in Q2. Micron CEO Sanjay Mehrotra emphasized that strong enterprise and AI-driven demand will sustain elevated utilization rates and pricing power through fiscal 2026, laying the groundwork for sustained double-digit growth toward a potential $1 trillion valuation by 2030.
2. Valuation Remains a Relative Bargain in the AI Era
Despite tripling in value over the past year, Micron trades at a trailing P/E of 32× and a forward P/E near 10.5×, with a PEG ratio of 0.58×. That valuation sits below many high-growth peers, even though Micron’s revenue growth and profit margins exceed those of larger incumbents. As major cloud providers and chip designers commit to record AI infrastructure budgets, Micron’s high-bandwidth memory (HBM) and DRAM solutions occupy a critical bottleneck in data-center architecture, making the stock appear undervalued relative to its growth trajectory and strategic positioning.
3. Strategic Capacity Expansion to Secure Long-Term Leadership
Micron signed a letter of intent to acquire Powerchip Semiconductor’s Tongluo P5 fabrication site in Taiwan for $1.8 billion, adding 300,000 square feet of 300 mm cleanroom capacity expected to begin meaningful DRAM output in H2 2027. Complementing this, the company has committed over $200 billion to expand U.S. production, including two fabs in Idaho and a 600,000-foot facility in Clay, New York, with first physical fabrication slated for 2030. These investments aim to address persistent memory shortages and strengthen Micron’s global footprint, reinforcing its ability to meet skyrocketing AI-driven demand through the end of the decade.