Micron Teams with Applied Materials on AI Chips and $5B EPIC Center
Micron is partnering with Applied Materials to co-develop next-generation DRAM, HBM and NAND memory chips optimized for AI workloads, integrating research at Applied’s EPIC Center and Micron’s Boise innovation hub. Applied is investing up to $5 billion in its Silicon Valley EPIC facility to accelerate semiconductor commercialization.
1. Expanded AI Memory Collaboration
Micron and Applied Materials have launched a joint effort to develop next-generation DRAM, HBM and NAND memory chips designed specifically for AI applications. Research teams will work across Applied’s EPIC Center in Silicon Valley and Micron’s innovation center in Boise, Idaho, to create advanced materials, manufacturing methods and chip architectures.
2. $5B EPIC Center Investment
Applied Materials is allocating up to $5 billion to build and equip its new EPIC (Equipment and Process Innovation and Commercialization) Center in Silicon Valley, with an opening planned later this year. The facility aims to shorten development cycles by providing chipmakers early access to cutting-edge equipment and processes prior to large-scale manufacturing.
3. Chip Technology Focus
The collaboration emphasizes energy-efficient high-bandwidth memory and advanced chip packaging to meet the power and speed demands of future AI systems. Engineers will integrate novel materials and packaging techniques to support low-power, high-throughput data handling for machine learning workloads.
4. Industry Equipment Demand Outlook
Strong AI-driven demand for advanced memory is fueling a projected 23% increase in wafer fabrication equipment spending to around $135 billion in 2026. This surge benefits both Micron and its equipment partners as chipmakers expand capacity for DRAM, NAND and specialized AI memory production.