Nvidia CEO Jensen Huang meets Samsung to expand HBM capacity for next-gen GPUs
NVDA•Nvidia CEO Jensen Huang met with Samsung executives in Seoul to negotiate expanded high-bandwidth memory (HBM) capacity for upcoming Hopper and Blackwell GPUs. The discussions aim to increase wafer allocations and advanced packaging support to address memory constraints and accelerate AI and data center GPU production.
1. Nvidia CEO Visits Samsung
Nvidia CEO Jensen Huang traveled to Samsung’s Seoul headquarters for high-level discussions focused on securing additional high-bandwidth memory (HBM) production capacity. The talks covered potential increases in wafer allocations and collaboration on advanced packaging techniques to meet the growing demand for memory-intensive AI workloads.
2. Impact on GPU Production
By strengthening its partnership with Samsung, Nvidia aims to alleviate previous HBM shortages that have constrained GPU rollouts. Expanded memory supply is expected to accelerate shipments of next-generation Hopper and Blackwell GPUs, supporting faster deployment in data center and AI applications.
