NXP Launches i.MX 93W SiP With 1.8 eTOPs NPU and Tri-Radio Connectivity
NXP Semiconductors unveiled the i.MX 93W applications processor, integrating a dedicated Arm Ethos NPU delivering up to 1.8 eTOPs with secure tri-radio wireless connectivity in one SiP, replacing up to 60 components. Pre-certified designs for Wi-Fi 6, Bluetooth LE and 802.15.4 slash RF integration time and certification complexity.
1. Product Integration and Performance
NXP’s new i.MX 93W applications processor combines a dual-core Cortex-A55 CPU with a dedicated Arm Ethos NPU capable of 1.8 eTOPs and integrates Wi-Fi 6, Bluetooth LE and 802.15.4 radios in a single package, allowing customers to replace up to 60 discrete components.
2. Pre-Certified Designs and Time-to-Market
Pre-certified single and dual-antenna reference designs are certified across multiple regions, eliminating complex RF tuning and coexistence challenges. This reduces integration effort, cuts certification costs and accelerates time-to-market for connected IoT, industrial and smart home products.
3. Target Applications and Markets
The i.MX 93W platform is optimized for physical AI applications such as coordinated smart building automation, wearable health monitoring and industrial gateway systems. Its secure EdgeLock enclave and scalable edge compute enable real-time, low-latency AI agent collaboration across devices.
4. Availability and Impact on NXP
Sampling of the i.MX 93W is scheduled for second half of 2026, positioning NXP to capture growing demand for integrated AI and wireless connectivity solutions. This launch could enhance NXP’s competitive edge and drive future revenue growth in the industrial and IoT segments.