According to the Korea Economic Daily, Qualcomm is in advanced discussions with Samsung Electronics to outsource production of its next-generation two-nanometre logic chips. CEO Cristiano Amon indicated that Qualcomm aims to leverage Samsung’s 2nm process node to diversify its foundry mix beyond current partners, potentially allocating up to 20% of its leading-edge wafer volumes in 2027. Analysts estimate this could unlock incremental capacity of 100,000 wafers per quarter, easing supply constraints for Qualcomm’s flagship mobile and networking SoCs.

Speaking at CES in Las Vegas, Cristiano Amon declared robotics the “next big wave” in AI, highlighting Qualcomm’s newly announced Dragonwing™ IQ10 robotics processor. The IQ10 delivers up to 50 TOPS of on-chip AI performance at under 15 W power draw and integrates real-time safety features for industrial autonomous mobile robots (AMRs) and humanoids. Qualcomm forecasts the robotics segment could contribute $500 million in revenue by 2028, underpinned by partnerships with OEMs such as Kuka and emerging deployments in logistics, healthcare and consumer service robots.

At CES 2026, Qualcomm unveiled the Snapdragon X2 Plus compute platform, featuring 3 nm Oryon CPU cores with a 25% uplift in single-thread performance and next-gen Adreno GPU delivering 30% higher graphics throughput over its predecessor. Targeting AI-enabled notebooks and detachable PCs, the X2 Plus supports up to 90 TOPS of neural processing and promises 20 hours of battery life on ultraportable designs. Qualcomm projects the platform will power over 50 commercial laptop models by year-end, aiming to capture 15% of the global premium PC segment by 2027.