Renesas Launches RA6W1 Wi-Fi 6 and RA6W2 Wi-Fi/Bluetooth MCUs with Ceva IP
Ceva’s Wi-Fi 6 and Bluetooth LE IPs power Renesas Electronics’ new RA6W1 dual-band Wi-Fi 6 and RA6W2 Wi-Fi 6/Bluetooth combo MCUs, offering developers flexible standalone or integrated wireless connectivity for smart home, industrial and IoT devices. The integration reduces BOM costs, simplifies design and enhances energy efficiency.
1. Integration of Ceva IP into Renesas MCUs
Renesas Electronics has incorporated Ceva-Waves Wi-Fi 6 and Bluetooth LE silicon IP into its newly launched RA6W1 dual-band Wi-Fi 6 MCU and RA6W2 combo Wi-Fi 6/Bluetooth LE MCU. The IP integration supports standalone Wi-Fi, combo Wi-Fi/Bluetooth configurations or fully integrated modules to meet varied application needs.
2. Design and efficiency benefits
By leveraging Ceva’s connectivity IP portfolio, Renesas’ MCUs deliver low-power operation, reduced bill of materials and simplified system design. The hosted or hostless implementation options streamline time-to-market for smart home, industrial automation and consumer IoT products.
3. Strategic impact for Ceva
This collaboration reinforces Ceva’s position as a leading licensor of wireless connectivity IP for the smart edge. Securing design wins with Renesas’ first combo MCUs could drive incremental licensing revenue and expand Ceva’s footprint in next-generation IoT and connected home markets.