Samsung to Ramp HBM4 Mass Production in February 2026, Earmarks Most 1α DRAM Capacity
Samsung Electronics will begin mass production of sixth-generation HBM4 chips in late February 2026, allocating most of its 1α DRAM capacity to the new product for early output. This ramp addresses surging AI memory demand and could secure more cost-effective, high-bandwidth modules for Nvidia’s next-generation GPUs.
1. Samsung Launches Sixth-Gen HBM4 Production
Samsung Electronics is set to start volume manufacturing of sixth-generation high-bandwidth memory (HBM4) chips in late February 2026, marking the industry’s first commercial rollout of this technology.
2. Capacity Allocation Strategy
The company has redirected the majority of its 1α DRAM wafer capacity to HBM4 production for early 2026, underlining a strategic push to secure leadership in the rapidly expanding AI memory market.
3. Implications for Nvidia GPU Supply
Nvidia’s upcoming data-center GPU lineup relies on HBM4 modules for higher throughput and efficiency, and Samsung’s capacity ramp could alleviate potential memory shortages and contribute to more stable supply and pricing.
4. Competitive Landscape
Rival SK Hynix is also advancing its 1α DRAM process for HBM4E products, intensifying competition as major memory suppliers vie to capture the booming demand for AI-optimized memory solutions.