Samsung will reportedly use TSMC technology for Nvidia's next-generation memory chips
NVDA•Samsung will reportedly use TSMC's 3-nanometre process to produce base dies for Nvidia's next-generation custom high-bandwidth memory chips, a Seoul newspaper reported.
1. Reported manufacturing plan
Samsung Electronics will reportedly use TSMC's 3-nanometre process to produce base dies for Nvidia's next-generation custom high-bandwidth memory (HBM) chips, a Seoul newspaper reported. The newspaper said this would be the first time Samsung has worked with TSMC at the HBM manufacturing stage.
2. Nvidia's requirements
Nvidia has asked Samsung, SK Hynix and Micron Technology to use TSMC's process for NVHBM base dies and sixth-generation DRAM technology for core dies, the newspaper reported, citing industry sources. Nvidia unveiled NVHBM in August; the chips integrate its custom memory controller into the base die and are aimed at standardizing implementation across multiple memory suppliers.
3. Samsung's production plans
The newspaper reported that Samsung accepted Nvidia's requirements after an internal review but plans to retain its in-house production model for standard HBM and custom products for other customers. Samsung is also assessing whether its own foundry could produce NVHBM base dies if demand exceeds TSMC's capacity, the newspaper quoted an unnamed source as saying.
