Schneider Electric, AMD release Helios AI rackscale reference design for high-density data centers
AMD•Technical targets and validation
The blueprint supports racks up to 246 kW and modular AI clusters up to 10.4 MW IT load, aiming for PUE near 1.12 at full load.
The design centers on liquid cooling, using CDU-based systems, and targets removal of up to 84% of heat from high-density AI deployments.
The initial framework was validated to US ANSI standards, with plans to extend it to IEC standards for broader global deployment.
Reference design for AMD Helios rackscale AI platform
Schneider Electric entered a collaboration with AMD to co-develop a validated reference design for AMD’s Helios rackscale AI platform.
The reference design targets faster rollout of high-density AI “factory” data centers, aiming to cut integration risk across power, cooling, and IT layout.
