SEALSQ Signs LOI to Acquire Miraex, Completing Quantum Interconnect Layer by June
SEALSQ has signed a binding LOI to acquire 100% of Swiss photonics-based quantum interconnect developer Miraex, subject to due diligence and regulatory approvals in a 60-day exclusivity window. The transaction, funded through SEALSQ Quantum Fund, is slated to close by June 2026 and completes SEALSQ’s end-to-end quantum vertical stack.
1. LOI Details
SEALSQ has executed a binding LOI to acquire 100% of Miraex SA’s equity, triggering a 60-day exclusivity period for confirmatory due diligence and finalizing transaction documents. The acquisition, financed via the SEALSQ Quantum Fund, is targeted to close by end-June 2026, pending customary closing conditions and regulatory processes. Miraex develops photonics-based quantum interconnect solutions using Thin Film Lithium Tantalate (TFLT) photonic integrated circuits.
2. Strategic Integration
The deal plugs a critical gap in SEALSQ’s Quantum Vertical Stack by adding a photonics-based interconnect layer that converts between microwave and optical frequencies, bridging quantum processors with networks. Miraex’s TFLT PIC platform provides OEM-ready components for integration into SEALSQ’s semiconductor and post-quantum cryptography roadmap, enabling next-generation quantum-safe silicon solutions and distributed sensing. This vertical integration bolsters SEALSQ’s end-to-end quantum-secure offerings across computing, networking, and sensing domains.
3. Space-Based Implications
Miraex’s compact, radiation-tolerant TFLT PICs align with SEALSQ’s Quantum Spatial Orbital Cloud initiative by supporting deployment on nanosatellites and CubeSats in Low Earth Orbit. Their power-efficient photonic integration enables space-grade quantum networking and high-precision distributed sensing for aerospace and defense applications. This strategic alignment accelerates the development of global quantum infrastructure across terrestrial and orbital environments.