Shanghai Fudan Microelectronics forms Shanghai JV to develop high-power aging test systems, registered capital RMB 70 million
SOXX•Shanghai joint venture planned for high-power aging test systems
Shanghai Fudan Microelectronics signed a shareholders’ agreement on Aug. 17, 2026 to form a Shanghai joint venture.
The JV’s registered capital is set at RMB 70 million, with Fudan contributing RMB 17.5 million of intangible assets for a 25% stake.
Partners will contribute cash totaling RMB 52.5 million. Zhuoyuan Ruixin will lead with a 27.44% stake, followed by Zhuoyuan Yuxin at 19%.
The venture targets in-house development of high-power ageing test systems for semiconductors, aiming to operate the business as a standalone entity.
Governance gives Zhou Jun control of two of three board seats, and shareholders agreed to a five-year lock-up on equity transfers.
