SK hynix invests over $4 billion in Indiana HBM advanced packaging plant - SMH News | RalliesSK hynix invests over $4 billion in Indiana HBM advanced packaging plant
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SMH• Indiana advanced packaging plant to support next-generation HBM
- SK hynix broke ground on an advanced packaging plant in Indiana to support next-generation HBM for AI.
- Total investment is expected to exceed $4 billion, with the cleanroom targeted for October 2028.
- Mass production is slated for the second half of 2029, marking its first “Made in USA” next-generation HBM output.
- Korea-made wafers will be shipped to Indiana for packaging and testing, then supplied to U.S. customers.
- The project includes an on-site R&D testbed, and the buildout aims to support about 7,000 jobs during construction and operations.*
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Saba Capital reports $1.74 million BlackRock ESG Capital Allocation Term Trust common share sale
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