Sony and TSMC to Invest ¥1 Trillion in Joint Kumamoto Image-Sensor Fab
TSM•Sony and TSMC will invest ¥1 trillion to build a Kumamoto fab targeting 55,000 monthly 300 mm wafer starts for mobile and automotive image sensors by early 2027. The JV will be split 60/40 in TSMC’s favor and aims for a 30% foundry share in image sensors by 2028.
1. JV Formation and Investment
Sony and Taiwan Semiconductor Manufacturing Company formed a joint venture on May 8 to build a dedicated image-sensor foundry in Kumamoto Prefecture, Japan, with an initial investment of ¥1 trillion.
2. Production Capacity and Timeline
The facility will feature a 300 mm wafer line capable of 55,000 wafer starts per month, with production scheduled to commence in early 2027 to meet growing demand for high-resolution sensors.
3. Ownership and Roles
Under the JV structure, TSMC will hold a 60% stake and oversee fabrication operations while Sony retains 40% and contributes its image-sensor design expertise.
4. Market Impact and Goals
The partners aim to capture roughly 30% of the global image-sensor foundry market by 2028, focusing on components for mobile devices and advanced driver-assistance systems.
