Synopsys Launches Multiphysics Fusion with Up to 10× Faster Design Closure
SNPS•Synopsys has released its Multiphysics Fusion portfolio, integrating AI-powered EDA with Ansys signoff analysis across timing signoff, design closure, multi-die and analog workflows. The solutions deliver SPICE-accurate timings up to 3× faster, design closure up to 10× faster and show improved PPA in pilots with Cisco, MediaTek, NVIDIA and Samsung.
1. Availability of Multiphysics Fusion Solutions
Synopsys has unveiled its first Multiphysics Fusion portfolio, now available for deployment, which embeds Ansys golden signoff multiphysics analysis into AI-powered EDA across timing signoff, design closure, multi-die and analog design flows.
2. Performance Improvements
The new timing signoff flow offers SPICE-accurate multiphysics timing analysis up to 3× faster, while design closure achieves up to 10× faster runtimes with higher ECO success rates, improved power-performance-area metrics, and concurrent power integrity, electromagnetic and thermal analysis.
3. Early Customer Deployments
Industry leaders including Cisco, MediaTek, NVIDIA and Samsung have piloted Multiphysics Fusion, reporting enhanced predictability, reduced design iterations, up to 13× GPU-accelerated simulations and IR fix rates as high as 86% in select pilot designs.
