TI Unveils 1200 TOPS TDA5 SoCs and 4D Radar Chip with 30% Faster Detection
Texas Instruments launched its TDA5 SoC family delivering 10-1200 TOPS of edge AI with an NPU for up to SAE Level 3 autonomy and a chiplet-ready design. It also unveiled the AWR2188 eight-transmitter, eight-receiver 4D radar chip providing 30% faster performance and detection ranges beyond 350 meters.
1. Q4 and Full-Year 2025 Earnings Webcast Scheduled
Texas Instruments has confirmed it will host its Q4 and full-year 2025 earnings conference call on January 27 at 3:30 p.m. Central time, with live audio available via webcast on the Investor Relations section of TI’s website. CEO Haviv Ilan, CFO Rafael Lizardi and Investor Relations head Mike Beckman will present results and field questions. An archived recording will be posted shortly after the call concludes, allowing investors and analysts to review detailed commentary on revenue drivers, segment performance and cash-flow generation for the industrial, automotive, personal electronics and communications equipment markets.
2. Strategic IoT Collaboration with Afero Strengthens Secure Edge Offerings
TI has partnered with Afero to integrate its first purpose-built Wi-Fi microcontrollers into Afero’s secure IoT software platform, targeting smart home and industrial applications. The CC3501E and CC3551E MCUs support Wi-Fi 6, Bluetooth Low Energy 5.4 and hardware root-of-trust security. This joint solution, demonstrated at CES 2026, provides U.S.-sourced supply-chain assurance and enterprise-grade encryption on microcontroller-class hardware. Afero’s pairing-free onboarding and end-to-end encrypted sessions augment TI’s affordability and reliability, positioning the companies to address the projected surge in edge processing as Gartner estimates 75% of enterprise data will be generated and processed outside traditional datacenters by 2025.
3. Expanded Automotive Portfolio Accelerates Edge AI and Radar Innovation
At CES 2026, TI unveiled its TDA5 family of high-performance computing SoCs delivering 10 to 1,200 TOPS of edge-AI performance with over 24 TOPS/W efficiency and integrated C7™ NPUs offering up to 12× AI compute uplift versus prior generations. These chiplet-ready devices support SAE Level 3 autonomy and aim to centralize ADAS, infotainment and gateway functions, helping automakers simplify architectures and meet ISO 26262 ASIL-D requirements. TI also introduced the AWR2188 single-chip 8×8 4D imaging radar transceiver, achieving 30% faster analog-to-digital processing and >350 m detection range, and the DP83TD555J-Q1 10BASE-T1S Ethernet PHY with PoDL and nanosecond sync to extend Ethernet to vehicle edge nodes while reducing wiring complexity.
4. Core Strength in Analog and Embedded Processing Underpins Stability
TXN leverages its scale in analog and embedded processing to support long product cycles across industrial and automotive end markets, which together account for roughly 70% of revenue. While volumes remain below multiyear trends, modest recovery in factory automation and automotive production is helping utilization rates improve. TI’s focus on higher-value analog components and embedded solutions, combined with a dividend yield of approximately 3% and ten consecutive years of dividend growth, reinforces its appeal to income-oriented investors seeking stability rather than rapid cyclical swings.