TSM Secures HBM and Advanced Node Capacity Through 2028, Monitors Middle East Risks
Broadcom has secured high-bandwidth memory and advanced-node capacity at TSM through 2028, guaranteeing critical wafer volumes for its AI chip production. Separately, TSM reports it does not currently expect significant disruption from Middle East supply risks but will continue monitoring helium and material availability.
1. Broadcom Capacity Deal Through 2028
Broadcom has locked in high-bandwidth memory and advanced-node manufacturing capacity at TSM through 2028, ensuring stable wafer supply for its expanding AI ASIC business and addressing industry concerns over memory shortages.
2. Monitoring Middle East Supply Risks
TSM stated it does not currently anticipate major disruptions from Middle East tensions impacting helium or other critical materials, but it will continue tracking geopolitical developments and maintain contingency measures to safeguard production.