TSMC reportedly considers making advanced memory chips
TSM•TSMC is reportedly considering advanced memory chip production, including 3D DRAM, after a request from Nvidia. The company is exploring building factories or converting an existing plant, but no production start date is clear.
1. Plans for 3D DRAM
Taiwan Semiconductor Manufacturing Co has started charting plans to make 3D DRAM at Nvidia's request, the report said, citing two people with direct knowledge. TSMC could build new factories or acquire and convert an existing plant, but it was not clear when production might begin.
2. Memory market context
The potential move comes as an AI-driven memory chip shortage has pushed up prices and led chip designers to seek additional supply. 3D DRAM stacks memory cells vertically to boost capacity. TSMC's effort is overseen by Hsu Kuo-chin, a vice president who oversees advanced packaging, and would put it in competition with Samsung Electronics, SK Hynix and Micron.
