TTM Technologies Opens $130M Syracuse Ultra-HDI PCB Facility with 400 New Jobs
TTMI•TTM Technologies invested $130 million in a new 215,000 sq ft Ultra-HDI PCB facility in Syracuse, NY, supported by a $30 million Department of War grant and creating up to 400 new jobs. The plant expands TTM's Central New York workforce to roughly 1,000 and bolsters domestic defense electronics capacity.
1. Facility Opening and Capabilities
TTM Technologies inaugurated a 215,000 sq ft Ultra-HDI PCB manufacturing facility in Syracuse, New York, marking one of the first U.S. plants purpose-built for ultra-high-density interconnect and advanced packaging production. The new site enhances domestic electronics production for aerospace, defense, and high-technology markets.
2. Strategic Defense Impact
The Syracuse facility fills a critical gap in U.S. defense supply chains by producing PCBs essential for next-generation radar, missile defense, space-based sensors, and autonomous systems. Its domestic capability reduces reliance on Asian manufacturers and ensures smaller, faster, and more reliable electronics for military programs.
3. Investment Details and Workforce Growth
TTM's $130 million investment includes a $30 million grant from the Department of War and will create up to 400 new engineering and manufacturing roles. The project brings the company's Central New York workforce to approximately 1,000 employees, reinforcing the region's microelectronics ecosystem.
