UMC partners with AP Memory on power delivery solutions for AI, HPC systems
UMC•UMC and AP Memory partnered to develop power delivery solutions for AI and high-performance computing systems. AP Memory’s S-SiCap Gen2D designs completed tape-out and initial functional validation in the third quarter of 2026.
1. Development milestone
The collaboration combines UMC’s deep trench capacitor manufacturing with AP Memory’s silicon capacitor designs to improve power efficiency in advanced packages. System-level performance and reliability testing in substrate packages is next, and the partners are exploring capacitor-embedded interposers and landside capacitors.
