Amkor is committing $7 billion to a two-phase advanced-packaging campus in Arizona, with Phase I designed for 25,000 wafers per month. Construction is under way, with site grading complete and major concrete work begun, aiming for mid-2027 build completion and early-2028 production ramp.

CEO Kevin Engel highlighted advanced packaging—particularly 2.5D and high-density fan-out—as a key driver of AI and compute growth. The company expects roughly a threefold increase in 2.5D revenue and targets mid-to-high-teens gross margins in the second half of volume scaling.

CFO Megan Faust emphasized the company’s strong balance sheet, exiting 2025 with $3 billion in cash, a $1 billion unused credit line and 1.2x debt/EBITDA leverage. Amkor anticipates up to $2.8 billion in government grants and tax credits to support the U.S. expansion while maintaining capital returns and modest dividend growth.

Amkor is balancing capacity by leveraging existing sites in Korea and Portugal and planning further expansion in Vietnam. This strategy follows three pillars—technology leadership, footprint diversification and strategic partnerships—to serve key growth markets in AI compute, communications and automotive.