Lens Technology and Intel explore through-glass via packaging
Lens Technology’s Hong Kong unit signed a one-year memorandum of understanding with Intel to explore cooperation in through-glass via advanced packaging.
Talks center on process development for glass-substrate vias, with Intel providing manufacturing guidance and validation methods under separate agreements.
Any qualification work or volume production would require definitive contracts; the memorandum is largely non-binding aside from IP and confidentiality terms.
Lens has built pilot lines, started sample trial production, delivered samples to potential customers, and said the business has not yet affected results.
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