Micron Unveils HBM4, 256GB SOCAMM2 and 245 TB Gen6 SSDs for AI
MU•Micron unveiled its end-to-end AI-optimized memory and storage portfolio at COMPUTEX 2026, showcasing HBM4 36GB 12H that boosts large language model inference throughput by 2.6× and the world’s first 256GB SOCAMM2 low-power data center module. The company also highlighted 9,200 MT/s 256GB DDR5 RDIMMs, PCIe Gen6 SSDs up to 245 TB, GDDR7, LPDDR5X LPCAMM2, and UFS 4.1 automotive storage, supported by global manufacturing investments.
1. COMPUTEX 2026 SHOWCASE
Micron hosted an invitation-only showcase in Taipei from June 2–4 to demonstrate its full AI memory and storage portfolio, spanning high-bandwidth server modules to edge-optimized LPDDR and client SSD solutions.
2. DATA CENTER MEMORY INNOVATIONS
Key highlights include HBM4 36GB 12H enabling a 2.6× increase in LLM inference throughput, 256GB SOCAMM2 modules offering one-third the power and footprint of RDIMMs, and 256GB DDR5 RDIMMs at 9,200 MT/s with 40% lower power than dual 128 GB modules.
3. STORAGE AND CLIENT SOLUTIONS
The Micron 9650 PCIe Gen6 SSD now scales up to 245 TB, while the 6600 ION SSD cuts rack footprint by 82% and halves power vs HDD setups. Edge- and client-side offerings include 9,600 MT/s LPDDR5X LPCAMM2, 1.5 TB/s GDDR7, and UFS 4.1 for automotive ADAS.
4. MANUFACTURING AND PARTNERSHIPS
Backed by investments across the US, India, Japan, Singapore and Taiwan, Micron is deepening co-engineering with AI platform partners to accelerate product deployment and optimize system-level performance for next-generation workloads.
