Samsung Ships 12-Layer HBM4E Chips with 20% Speed Gain to AI Giants Including Google
GOOG•Samsung has started shipping samples of its 12-layer HBM4E high-bandwidth memory chips, offering over 20% performance improvement and built on sixth-generation 1c DRAM plus a 4-nm logic base die. Google is among initial recipients, potentially accelerating its AI server performance with next-gen memory modules.
1. Samsung Ships HBM4E Samples
Samsung has commenced shipping samples of its new 12-layer HBM4E high-bandwidth memory chips, boasting over 20% speed gain compared to its prior HBM4 generation and utilizing 1c DRAM process technology alongside a 4-nm logic base die.
2. Google Named Among Initial Customers
Google is listed among global customers receiving HBM4E samples alongside AMD and Nvidia, positioning the company to access advanced memory modules for AI servers and accelerator processors.
3. Potential Impact on Google AI Infrastructure
Adoption of HBM4E chips could enhance Google's data center performance for AI workloads by improving memory bandwidth, potentially accelerating training and inference times for models powering Google Cloud AI offerings.
4. Next Steps and Volume Shipments
Samsung plans to move from sample distribution to volume shipments after initial testing, likely in the coming quarters, which could lead to more widespread integration of HBM4E modules across Google's server farms.
