Synopsys Rolls Out AI-Powered 2nm Tool Flows, Boosts Test Efficiency 20%
SNPS•Synopsys has launched production-ready AI-powered digital and analog tool flows for Samsung’s third-generation 2nm class process, achieving up to 2.7% frequency boosts with ≤5% leakage degradation and delivering 20% faster test cycles. Certified multiphysics signoff via PrimeShield and Totem-SC further enhances PPA and power integrity on advanced 2nm and 4nm nodes.
1. AI-Powered 2nm Class Flows and PPA Gains
Synopsys has unveiled production-ready AI-driven digital and analog flows for Samsung Foundry’s third-generation 2nm class process. Leveraging deep design technology co-optimization, the Fusion Compiler delivers measurable power and performance improvements over the prior 2nm generation, enabling faster migration to advanced nodes.
2. Certified Multiphysics Signoff Enhancements
New PrimeShield Process Sensitivity Analysis and PVT Explorer tools support design-specific optimization and ECO decisions at signoff, achieving up to 2.7% frequency improvement with only 5% leakage increase. Additionally, Totem-SC’s certified electromigration and IR drop analysis on second-generation 2nm and 4nm processes strengthens power integrity and reliability.
3. AI-Fueled Test Efficiency Improvements
Synopsys TestMAX with AI-assisted ATPG (TSO.ai) has been validated on Samsung Foundry nodes to cut test patterns and cycles by up to 20% while preserving fault coverage on SoC and multi-die designs. Physically aware tests and advanced failure diagnosis accelerate turnaround and improve test quality.
4. Unified 3DIC Signoff Platform for Multi-Die Designs
The Synopsys 3DIC Compiler unites planning, implementation and certified multiphysics analysis to support Samsung’s Hybrid Copper Bonding 3D multi-die solutions. This unified exploration-to-signoff platform automates system co-optimization across compute, memory and packaging layers, enhancing designer productivity and quality of results.
