TSMC Launches CoPoS Pilot, Targets 2029 Production; VP Buys Shares
TSM•TSMC has launched pilot lines at VisEra's Longtan and Chiayi AP7 facilities to develop CoPoS panel-level packaging, targeting mass production in 2029 to reduce interposer waste and lower AI chip costs. Insider VP Tien Bor-Zen acquired 1,000 shares at $75.70, while a recent data leak highlights supply chain security risks.
1. CoPoS Development and Timeline
TSMC is advancing its CoPoS next-generation packaging by shifting from 12-inch wafers to 310mm square panels. Pilot lines at VisEra's Longtan plant and the AP7 facility in Chiayi aim to validate processes through 2029 mass production, promising near-elimination of interposer waste as AI chips grow in size.
2. Insider Share Purchase
On June 30, VP Tien Bor-Zen bought 1,000 TSMC shares at $75.70 each, increasing his holdings. This insider buy signals executive confidence in TSMC’s long-term prospects amid strong demand for advanced AI packaging solutions.
3. Supply Chain Security Concerns
TSMC has enforced strict NDAs across its supplier base, but a recent leak of iPhone 18 Pro files on the dark web exposed data security vulnerabilities. The incident underscores risks in TSMC’s global operations and the importance of safeguarding proprietary research.
