TSMC Plans 3nm Production in Japan Fab with 15,000-Wafer Monthly Capacity
TSMC will install equipment and start mass production of 3-nanometre wafers at its second Japanese fabrication plant in 2028, aiming for a monthly output of 15,000 12-inch wafers. The expanded plan builds on over $20 billion invested in both Japanese fabs and may involve roughly $17 billion for the new plant.
1. Equipment Installation and Production Timeline
TSMC will begin equipment installation at its second Japanese fabrication plant in 2028 and launch mass production of 3-nanometre wafers later that year, marking its first overseas deployment of this advanced node.
2. Investment and Capacity Details
The new plant targets a monthly capacity of 15,000 12-inch wafers under the 3nm process. Combined with its first Japanese fab, TSMC has committed over $20 billion in total investment, with the second facility alone potentially costing up to $17 billion.
3. Strategic Partnerships and Context
TSMC established its Japan unit in 2021 alongside Sony Semiconductor Solutions, with Denso and Toyota joining as minority investors. This expansion diversifies TSMC’s geographic footprint and secures local support for advanced chip manufacturing.