Xanadu and EV Group have entered a strategic collaboration to integrate EVG’s wafer bonding and lithography equipment into Xanadu’s photonic quantum chip production. The agreement focuses on developing reliable heterogeneous integration processes to bond materials like silicon, lithium niobate, and III-V semiconductors on a single chip.

By leveraging EVG’s high-precision bonding expertise, the partners aim to create ultra-clean, high-precision interfaces essential for complex photonic circuits. Heterogeneous integration enables the combination of multiple functional materials, enhancing circuit density, performance stability, and scalability of quantum processors.

The collaboration is designed to shift Xanadu’s photonic chip fabrication from specialized laboratories to industrial semiconductor foundries. Utilizing EVG’s volume-manufacturing tools should streamline process development and reduce per-chip costs as production scales.

This partnership accelerates Xanadu’s roadmap toward a commercially viable, fault-tolerant quantum data center by addressing critical manufacturing bottlenecks. Establishing a scalable supply chain for photonic quantum hardware strengthens Xanadu’s competitive position in the emerging quantum computing market.