Cisco Unveils TSMC 3nm Silicon One G300 Chip to Target $600B AI Market
Cisco unveiled the Silicon One G300 chip built on TSMC’s 3nm process with a shock absorber to prevent data spikes, targeting H2 2026 launch in the $600 billion AI infrastructure market. The company expects the G300 to accelerate AI tasks by 28% via microsecond rerouting, positioning it against Broadcom and Nvidia.
1. Launch of Silicon One G300
Cisco introduced the Silicon One G300 chip and a companion router designed to accelerate data movement inside large data centers, marking its latest entry into AI infrastructure hardware.
2. Advanced 3nm Process and Shock Absorber
The G300 is manufactured using TSMC’s 3nm process and incorporates a shock absorber feature that automatically reroutes data around network issues within microseconds to prevent packet slowdowns during traffic surges.
3. Competitive Positioning in AI Infrastructure
The new chip targets a share of the $600 billion AI infrastructure market, positioning Cisco to compete directly with Broadcom and Nvidia for high-performance switching in large-scale data center environments.
4. Performance Impact and Financial Outlook
Cisco projects the G300 will boost select AI computing tasks by 28%, with sales slated for the second half of 2026, potentially driving meaningful revenue growth and margin enhancements as adoption scales.