Tower Semiconductor Launches Gen3 LDMOS Platform for $2.5B AI Power Management Market

TSEMTSEM

Tower Semiconductor released its Gen3 BCD power management platform featuring industry-leading LDMOS devices that cut switching losses and shrink die size for high-current AI data center and mobile PMIC applications. The technology targets a $2.5 billion monolithic smart power stage and DrMOS market expanding to $4.7 billion by 2031.

1. Gen3 BCD Power Management Platform

Tower Semiconductor's Gen3 BCD power management platform includes a new family of LDMOS power devices designed for high-current AI data center and mobile PMIC applications, offering ultra-low switching and conduction losses and enabling substantial die size reduction.

2. Addressing the AI Power Wall

The Gen3 LDMOS technology tackles critical power delivery bottlenecks in AI infrastructure by improving power delivery efficiency, reducing heat generation, and enhancing overall system performance as processor power demands rapidly increase.

3. Market Opportunity and APEC Presentation

The platform targets a $2.5 billion monolithic smart power stage and DrMOS market projected to grow to $4.7 billion by 2031, and Tower will showcase the technology at APEC 2026 in San Antonio from March 23–25 at booth #1455.

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